99.95% Pure Tungsten Targets with W1 ASTM B760

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99.95% Pure Tungsten Targets With W1 ASTM B760

Tungsten titanium alloy sputtering target can be used to make the diffusion barrier for semiconductor chips, the new solar cell and the ceramic thin film circuit.

Tungsten silicon alloy sputtering target can be used for the ohmic contact layer of the semiconductor chips.

Type

W(wt%)

Ti(wt%)

Si(wt%)

Purity(wt%)

Density(%)

Grain Size& (µm)

Dimension (max.mm)

Ra

WTi10

90±0.5

10±0.5

/

99.9-99.999

=99

?10

?400×40

=1.6

WTi20

80±0.5

20±0.5

/

99.9-99.995

=99

?10

?400×40

=1.6

WSi10

90±0.5

/

10±0.5

99.9-99.999

=99

?10

?400×40

=1.6

WSi20

80±0.5

/

20±0.5

99.9-99.999

=99

?10

?400×40

=1.6


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Shaanxi Aone Titanium Metal Materials Co.,Ltd

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