AHL-EP25 Semiconductor Laser Marking

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Laser cutting is mainly used to melt some of the cut material or activity is not easily oxidized metal, such as stainless steel, titanium, aluminum and its alloys.

Laser oxygen cutting fold

Laser oxygen cutting principle is similar to oxyacetylene cutting. It is used as a preheating laser source, with oxygen and other reactive gas as cutting gas. Blowing out gas on the 


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