
High Quality Multilayer PCB Board with HDI
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1
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Product Unit
Pieces
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Origin
China Mainland
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- Description
Product Detail
Model NO.: KDPCB-18
Flame Retardant Properties: V0
Base Material: Aluminum Base Board
Processing Technology: Electrolytic Foil
Mechanical Rigid: Rigid
Brand: kdpcb
Board Thickness: 0.5-5.0mm
Max. Board Thickness: 5.0 mm
Min. Letter Line Width: 0.15mm
Specification: UL, SGS, ISO14001, ISO9001
HS Code: 85340090
Type: Rigid Circuit Board
Dielectric: Aluminum Base Board
Insulation Materials: Metal Composite Materials
Application: Consumer Electronics
Material: Aluminum Base Board
Copper Thickness: 1-5 Oz
Layers: 1-24 Layers
Min. Line Width/Space: 0.1mm
Trademark: HYY
Origin: Made in China
Aluminum PCB board
Board material: Normal
Board thickness:1.0mm
Copper thickness: 1oz
Thermal conductivity: 1.5W/MK
Withstanding voltage: 2000V
Solder resist: White
Surface finishing: solder coating
Special drill hole: NO
Certification: UL, ISO14001, ISO9001, SGS, TS16949
Used for high power led, electronics, machinery, industrial lighting and so on.
Good price and best price.
Factory Manufacture Capability | ||
NO | ITEM | Techinical capabilities |
1 | Materials | FR-4, CEM-3, Al Base, Cooper Base. |
2 | Material Type | TOTKING T111, EASTPOWER EPA-M0 |
3 | Layers | 1 Layer |
4 | Min. core material | PP |
5 | Max. board size | 600mm *1200mm |
6 | Copper Thickness | 1-5 OZ |
7 | Min. board thickness | 0.5 mm |
8 | Max. board thickness | 5.0 mm |
9 | Min. line width/space | 0.1mm |
10 | Min. Letter line width | 0.15mm |
11 | Min. Letter height | 0.8mm |
12 | Min. hole size | 0.75mm(NPTH) |
13 | Hole dia. tolerance | ±0.05mm |
14 | solder Mask | White, Black, Green |
15 | Outline Tolerance | ±0.15mm |
16 | Modeling | Punching, Routing, V-cutting |
17 | Special Hole | Blind hole, Blind slot, T-hole, T-slot, Counter sink hole, Cup hole |
18 | Peel Strength | >=1.3N/mm |
19 | Thermal Stress | 288ºC, 2min |
20 | Thermal Conductivity | >=2.0 W/m-k |
21 | Thermal Resistance | ≤0.55 ºC/W |
22 | Test Voltage | 5 V |
23 | Surface Finish | HAL , OSP , Immersion Gold |
24 | File Format | Gerber , DPF, HPGL,CAM,DXP,CADM,PADS |
25 | Dielectric Breakdown | >=2.5 KV |
26 | Max. Package Size | 1200mm*600 mm |
Project | Surface Finish | ||
Note | Stencil Manufacturing | ||
Number of Layers | Stencil Material | ||
Material | Stencil Thickness(um) | ||
Material Thickness(mm) | Stencil Format | ||
Copper Thickness(um) | PCB Dimensions(mm) | ||
Solder Mask Color | Min Finished Hole Size(mm) | ||
Silk Screen Color | Min Clearance(mm) | ||
Milling | Min Track Width(mm) |
a) Base material: FR4/ AL/ FPC/ CEM-1/ CEM-3/ 94v0/ Rogers
b) Board thickness: 1.6mm-3.2mm/ 0.3mm-1.2mm
c) Copper thickness: Hoz/ 1oz/ 2oz/ 3oz/ 4oz, ect
d) Surface treatment: eg. Immersion gold/ OSP
e) color of solder mask and silkscreen: Green/White/Black/Red/Blue/Yellow
f) Quantity and board size
Delivery Timescales
Sample
*Single layer 4days
*Double Side 4-6days
*Aluminum PCB 7-10days
*Urgent Routing sample could be pushed 2-3 days earlier with premium.
Mass Production
*Single layer standard 10 days
*Double Side standard 12days
*Aluminum PCB standard 15days
*Material availability dependant.
Package & Shipping Method:
1.Vacuum package with silica gel, Carton box with packing belt.
2.By DHL, UPS, FedEx, TNT
3.By EMS (Usually for Russia Clients)
4.By sea for mass quantity according to customer's requirement
Payment method
1. T/T
2. Paypal
3. Western Union
Primary Competitive Advantages:
Country of Origin
Green Product
Price
Product Performance
Quality Approvals
Service
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