Selective Wave Soldering Machine

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1
Product Unit

Pieces
Origin

China Mainland
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Description

Product Detail

Selective Soldering Machine

NXP-450_??(002).jpg

Features
? High accuracy
? Stable and reliable
? Production efficiency and maintenance easily
? Available offline programming
Used two zones hot air for the top preheating system.

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Adopted CCD camera to monitor solder processing,the soldering quality can be traced in whole processing.	Selective flux spraying can control the flux processing accurately as well as keeping the clear surface of PCB with extremely low flux consumption.	Transmission speed of wave nozzle is adjustable, In line wave height monitoring system and automatic calibration function.	The temperature controls for top and bottom preheating is independent, Cs lamp heating can improve heating efficiency ad temperature uniformiy.

Specifications

Items	Description
Model	NXP-450
Min.PCB size	L 120mm * W 60mm
Max.PCB size	L 550mm * W 450mm
PCB top side / bottom side clearance	Max.Upper 100mm/ bottom 50mm
PCB process edge	4mm
Boards handling system
Conveyor system	3 independent zone with independent control, chain and special turn plate
Conveyor heights	850+/-50mm
Width adjustment	60mm to 460mm
Width adjustment accuracy	+/-0.2mm
Conveyor direction	Left to right / right to left
Preheating system – Bottom side
Preheating temperature/ Power	Max.160°C (PCB surface)/ Max.18KW
Temperature control accuracy	+/-2°C@3 sigma/Cpk=1.33
Heater	Philips Cesium light, independent control
Heating area	L 650MM * W 580MM
Preheating system – Top side
Preheating temperature/ power	Max. 160°C (PCB surface)/ Max.8KW
Temperature control accuracy	+/-2°C@3 sigma/Cpk=1.33
Heater	Hot air, independent control
Fluxing system
Fluxer nozzle	micro drop jet fluxer
Fluxing wet area	Ø2 mm to Ø5mm
flux types	alcohol or water based
Fluxing Controller	automatic level control with capacitive sensor
Selective position method	X-Y Platform
Position speed/ accuracy	Max.400mm/s , +/-0.25mm
flux container	3L pressure tank
Soldering Unit for Soldering Processes
solder pot compatible for lead free soldering	Standard
nitrogen operation	Standard
automatic wave height and solder level control	Standard
automatic wire solder feeder	Standard
wettable and non-wettable quick change nozzles	Standard
solder bath temperature	300°C
Temperature control accuracy	+/-2°C@3 sigma/Cpk=1.33
Solder pot capacity	12kg lead free
Wave heights	Max.5mm
Solder pot moving speed	Max.400mm/s
Soldering nozzle dimensions	Ø5 to Ø12mm (or customized)
Control system
Power supply	380VAC,3 P, 50/60Hz, 52A
PCB data import	GERB file, Offline file import, Image program
Programing interface	Windows interface
Power	35KW